JPH01133763U - - Google Patents
Info
- Publication number
- JPH01133763U JPH01133763U JP2891288U JP2891288U JPH01133763U JP H01133763 U JPH01133763 U JP H01133763U JP 2891288 U JP2891288 U JP 2891288U JP 2891288 U JP2891288 U JP 2891288U JP H01133763 U JPH01133763 U JP H01133763U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- board
- pattern
- printed circuit
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2891288U JPH01133763U (en]) | 1988-03-04 | 1988-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2891288U JPH01133763U (en]) | 1988-03-04 | 1988-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133763U true JPH01133763U (en]) | 1989-09-12 |
Family
ID=31252662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2891288U Pending JPH01133763U (en]) | 1988-03-04 | 1988-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133763U (en]) |
-
1988
- 1988-03-04 JP JP2891288U patent/JPH01133763U/ja active Pending